ZS-GF-5299E丨RTV Zweiteilige Silikon-Vergussmasse mit 0,6 W/m·K Wärmeleitfähigkeit

Model : ZS-GF-5299E
Certification : REACH ROHS UL
Packaging : 10kg/paiol, 20kg/pail, 25kg/pail
Brand : Jointas
Port : Guangzhou, Shenzhen, Yiwu, Shanghai, Hangzhou, Qingdao, Lianyungang, China
Place : Guangzhou, China


5299E is a low-viscosity two-component addition silicone potting compound with medium thermally conductive. It can be applied to the surface of PC, PP, ABS, PVC and other materials and metal materials. 
Product manual
5299E is a low-viscosity two-component addition silicone potting compound with medium thermally conductive. It can be applied to the surface of PC, PP, ABS, PVC and other materials and metal materials. 
Product feature
 Room temperature or heat accelerated cure
 No substance is released during curing
 Flexible and stable from -40 °C to 200 °C after cured 
 Excellent electrical properties with high impedance and high dielectric strength
 Excellent anti-sedimentation design, suitable for long-distance transportation and long-term storage
Main purpose
 Suitable for general potting/encapsulant material of power supplies or other components thermal release
● Potting the power modules and electronic components to protect


 
Standards compliant
REACH
ROHS
UL
 
Technical parameters
Artikel Part A Part B Standard

Uncured
Farbe Grey,Black,White  White Q/ZS 1-2016
Viscosity(cps,25℃) 15003000 15002500 GB/T 10247
Mixing ratio by weight 1∶1 Q/ZS 1-2016
Viscosity after mixing(cps,25℃) 15003000 GB/T 10247
Arbeitszeit(min25℃) 30-50 Q/ZS 1-2016
Curing time(hr25℃) 3-5 GB/T 531.2
Cured Hardness(shore A) 40-50 GB/T 531.2
Thermal conductivity[W/(m·K)] ≧0.6 ASTM D5470
Dielectric strength(KV/mm) ≧18 GB/T 1695
Dielectric constant(1.0MHz) 2.4~3.0 GB/T 1694
Volume Resistivity(Ω·cm) 1.0×1013 GB/T 1692
Specific Gravity (g/cm3) 1.56±0.02 GB/T 13354
UL 94 Flame Classification UL94 V0 UL 94
  Coefficient of thermal expansion (ppm/℃) 220 HGT 2625-1994
Use restrictions
Reasons for poor curing of addition silicone potting compound:
1.Contact materials: When in contact with the following ingredients, it will affect the surface curing. The slight one will only cure incompletely on the surface, and the heavy one will cause permanent or even incomplete curing:
   ● Release agent, such as detergent;
   ● Plasticizers, such as certain plasticizers in insulating plastics, wires and protective coils;
   ● Substances containing nitrogen, phosphorus, sulfur and halogen, such as natural rubber and neoprene;
   ● Soldering flux, such as rosin;
   ● Organometallic (lead, tin, mercury, etc.);
   ● Amine-containing substances, such as polyurethane and epoxy resin
   ● Condensation silicone sealant or potting compound
2.Environment: When using, avoid residual oil in the container or the object being used; avoid some impurities falling into it;avoid contact with some commonly used plasticizer plastic and
rubber glove; whether the vacuum equipment or oven has used (at the same time) epoxy resin, polyurethane, condensation silicone products.
3.
Operational aspects: The mixing ratio is not carried out in accordance with the technical parameters; because some products have not been used for a long time, there is some sedimentation, and each component is not fully stirred before use.